A 3D-Integrated 2-Megapixel Imager with Sparse Capture and Fine-Grain Power Gating




Berkovich, A.; Alkalay, S.; Tsai, T.; Liu, C.; Laiho, M.; Paasio, A.; Poikonen, J.; Grönroos, M.; Kutila, M.; Mäki, P.; Naula, M.; Säntti, T.; Komulainen, T.

N/A

International Electron Devices Meeting

PublisherIEEE

2023

 Technical digest - International Electron Devices Meeting

2023 International Electron Devices Meeting (IEDM)

1

4

979-8-3503-2768-7

979-8-3503-2767-0

0163-1918

2156-017X

DOIhttps://doi.org/10.1109/IEDM45741.2023.10413713

https://doi.org/10.1109/iedm45741.2023.10413713




Last updated on 24/02/2026 09:42:39 AM