Thickness dependence of microcrack formation in YBa2Cu3O6+x thin films on NdGaO3 (001) substrates




Palonen H, Huhtinen H, Paturi P

PublisherELSEVIER SCIENCE SA

2011

Thin Solid Films

THIN SOLID FILMS

THIN SOLID FILMS

22

519

22

8058

8062

5

0040-6090

DOIhttps://doi.org/10.1016/j.tsf.2011.06.106(external)



Thickness dependence of parallel microcrack formation in YBa2Cu3O6+x thin films prepared by pulsed laser deposition from nano- (n) and microcrystalline (mu) targets on NdGaO3 (001) is systematically investigated. Atomic force microscope and x-ray diffraction measurements show parallel microcracks normal to uniaxial twin boundaries. The amount of microcracks increases with film thickness. Superconducting properties of the films decrease very strongly with film thickness as a result of microcrack formation. The n-films have more rigid lattice and thus show more extensive cracking than mu-films. It is found that the mu-films have a thickness threshold (similar to 70 nm) where the first signs of cracking appear. (C) 2011 Elsevier BM. All rights reserved.



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