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Thickness dependence of microcrack formation in YBa2Cu3O6+x thin films on NdGaO3 (001) substrates




TekijätPalonen H, Huhtinen H, Paturi P

KustantajaELSEVIER SCIENCE SA

Julkaisuvuosi2011

JournalThin Solid Films

Tietokannassa oleva lehden nimiTHIN SOLID FILMS

Lehden akronyymiTHIN SOLID FILMS

Numero sarjassa22

Vuosikerta519

Numero22

Aloitussivu8058

Lopetussivu8062

Sivujen määrä5

ISSN0040-6090

DOIhttps://doi.org/10.1016/j.tsf.2011.06.106


Tiivistelmä
Thickness dependence of parallel microcrack formation in YBa2Cu3O6+x thin films prepared by pulsed laser deposition from nano- (n) and microcrystalline (mu) targets on NdGaO3 (001) is systematically investigated. Atomic force microscope and x-ray diffraction measurements show parallel microcracks normal to uniaxial twin boundaries. The amount of microcracks increases with film thickness. Superconducting properties of the films decrease very strongly with film thickness as a result of microcrack formation. The n-films have more rigid lattice and thus show more extensive cracking than mu-films. It is found that the mu-films have a thickness threshold (similar to 70 nm) where the first signs of cracking appear. (C) 2011 Elsevier BM. All rights reserved.


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