A4 Vertaisarvioitu artikkeli konferenssijulkaisussa
Resistivity Modeling of Copper Nanowires with Sub-100 nm Diameter
Tekijät: Matić, M.; Miljavac, A.; Sharma, V.; Poljak, M.
Toimittaja: Babic, Snjezana; Car, Zeljka; Cicin-Sain, Marina; Ergovic, Pavle; Grbac, Tihana Galinac; Gradisnik, Vera; Gros, Stjepan; Jovic, Alan; Jurekovic, Darko; Katulic, Tihomir; Koricic, Marko; Mornar, Vedran; Petrovic, Juraj; Skala, Karolj; Skvorc, Dejan; Sruk, Vlado; Tijan, Edvard; Valacich, Joe; Vrcek, Neven; Vrdoljak, Boris
Konferenssin vakiintunut nimi: MIPRO ICT and Electronics Convention
Julkaisuvuosi: 2025
Journal: International Convention on Information and Communication Technology, Electronics and Microelectronics
Kokoomateoksen nimi: 2025 MIPRO 48th ICT and Electronics Convention
Vuosikerta: 48
Aloitussivu: 1714
Lopetussivu: 1719
ISBN: 979-8-3315-3598-8
eISBN: 979-8-3315-3597-1
ISSN: 1847-3938
eISSN: 1847-3946
DOI: https://doi.org/10.1109/MIPRO65660.2025.11131863
Verkko-osoite: https://ieeexplore.ieee.org/document/11131863
The high conductivity of copper nanowires (CuNWs) with a diameter of less than 100 nm makes them promising candidates for various applications, including interconnects for nanoelectronics and flexible transparent conductive surfaces (TCS). One of the most important parameters is the resistivity of CuNWs, which is mainly determined by the size and structural imperfections such as surface and grain boundary scattering. Compact and exact models are used that accurately describe the resistivity for sub- 100 nm-wide CuNWs where the mean free path is comparable to the critical dimension of the nanowire. We analyze the resistivity as a function of diameter and various scattering parameters, such as specularity, reflectivity and mean grain size. We found that the grain boundary effect dominantly determines the resistivity while surface scattering acts as correction factor. We show that the expected resistivity is lower than 10×10−8Ω m, potentially indicating good applicability for high-conductivity TCSs even for structurally imperfect CuNWs.
Julkaisussa olevat rahoitustiedot:
This work was done as part of the project DURATRANS supported by M-ERA.NET 3, which is co-funded by the European Union Horizon 2020 research and innovation programme under grant agreement No. 958174. M.P. acknowledges support by the Ministry of Science, Education and Youth of the Republic of Croatia.
