A1 Vertaisarvioitu alkuperäisartikkeli tieteellisessä lehdessä
ESTONIAN LOGISTICS MARKET 2018 SURVEY: ANALYSIS AND FINDINGS
Tekijät: Ain Kiisler, Tomi Solakivi, Olli-Pekka Hilmola
Kustantaja: POZNAN SCH LOGISTICS
Kustannuspaikka: 1734-459X
Julkaisuvuosi: 2020
Journal: LOGFORUM
Tietokannassa oleva lehden nimi: LOGFORUM
Lehden akronyymi: LOGFORUM
Vuosikerta: 16
Numero: 3
Aloitussivu: 409
Lopetussivu: 420
Sivujen määrä: 12
ISSN: 1895-2038
eISSN: 1734-459X
DOI: https://doi.org/10.17270/J.LOG.2020.468
Rinnakkaistallenteen osoite: https://research.utu.fi/converis/portal/detail/Publication/49371249
Background: Estonian logistics market survey has been completed three times (during years 2007, 2012 and 2018), and this research reports development from the most recent survey concerning operating conditions and logistics costs as well as performance. Survey concerns manufacturing, trading and logistics service companies.Methods: Research data was gathered through an online survey executed during summer and early autumn of 2018. The survey received a total of 122 responses from manufacturing, trade and logistics service provision. Results of the study are compared to earlier years, and with the same approach completed Finnish logistics market survey.Results: Survey responses showed that Estonian logistics market has been experiencing overheating and the costs of logistics activities are clearly increasing. Logistics service providers have experienced negative effects resulting thereof more than manufacturers or trading companies. Inventories and delivery times have increased, which has resulted in longer cash conversion cycles. Other than inventory and lead time related supply chain metrics have developed positively, indicating that the overall performance in Estonian logistics has remained high.Conclusions: Increase of logistics costs and inventories remain as main future challenge for Estonian logistics. In other regards, development has been good, and quality of e.g. logistics services and customs have increased and is at high level.
Ladattava julkaisu This is an electronic reprint of the original article. |  |
