Thermal-Cycling-aware Dynamic Reliability Management in Many-Core System-on-Chip - UTU Research Portal

A4 Refereed article in a conference publication

Thermal-Cycling-aware Dynamic Reliability Management in Many-Core System-on-Chip

Authors: Haghbayan M.H., Miele A., Zouv Z., Tenhunen H., Plosila J.

Editors: Giorgio Di Natale, Cristiana Bolchini, Elena-Ioana Vatajelu

Conference name: Design, Automation & Test in Europe Conference & Exhibition

Publisher: Institute of Electrical and Electronics Engineers Inc.

Publication year: 2020

Journal: Proceedings : Design, Automation, and Test in Europe Conference and Exhibition

Book title : 2020 Design, Automation & Test in Europe Conference and Exhibition (DATE)

Journal name in source: Proceedings of the 2020 Design, Automation and Test in Europe Conference and Exhibition, DATE 2020

First page : 1229

Last page: 1234

ISBN: 978-1-7281-4468-9

eISBN: 978-3-9819263-4-7

ISSN: 1530-1591