A4 Refereed article in a conference publication

Thermal Modelling of 3D Multicore Systems in a Flip-Chip Package

Authors: Vaddina K R, Mitra T, Liljeberg P, Plosila J

Publisher: IEEE

Publication year: 2010

Book title : IEEE International SoC Conference (SoCC 2010)

First page : 379

Last page: 383

Number of pages: 5

ISBN: 978-1-4244-6682-5

ISSN: 2164-1676

DOI: https://doi.org/10.1109/SOCC.2010.5784700