Exploring a Low-Cost Inter-layer Communication Scheme for 3D Networks-on-Chip

: Rahmani A-M, Liljeberg P, Plosila J, Tenhunen H

Publisher: IEEE

: 2010

: Proc. of IEEE 15th International Symposium on Computer Architecture & Digital Systems (CADS’10)

: 163

: 166

: 4

: 2325-9361