A4 Refereed article in a conference publication

A Novel Interlayer Bus Architecture for Three Dimensional Network-on-Chips




AuthorsDaneshtalab M, Ebrahimi M, Liljeberg P, Tenhunen H

Publication year2010

JournalProceedings : Design, Automation, and Test in Europe Conference and Exhibition

Book title Proceeding of 3D Integration Workshop in Design Automation and Test Europe Conference (DATE)

ISSN1530-1591




Last updated on 2024-26-11 at 17:32