A4 Vertaisarvioitu artikkeli konferenssijulkaisussa

A Novel Interlayer Bus Architecture for Three Dimensional Network-on-Chips

Tekijät: Daneshtalab M, Ebrahimi M, Liljeberg P, Tenhunen H

Julkaisuvuosi: 2010

Journal: Proceedings : Design, Automation, and Test in Europe Conference and Exhibition

Kokoomateoksen nimi: Proceeding of 3D Integration Workshop in Design Automation and Test Europe Conference (DATE)

ISSN: 1530-1591