A1 Refereed original research article in a scientific journal

Regenerative Electroless Etching of Silicon




AuthorsKurt W. Kolasinski, Nathan J. Gimbar, Haibo Yu, Mark Aindow, Ermei Mäkila, Jarno Salonen

PublisherWILEY-V C H VERLAG GMBH

Publication year2017

JournalAngewandte Chemie International Edition

Journal name in sourceANGEWANDTE CHEMIE-INTERNATIONAL EDITION

Journal acronymANGEW CHEM INT EDIT

Volume56

Issue2

First page 624

Last page627

Number of pages4

ISSN1433-7851

DOIhttps://doi.org/10.1002/anie.201610162


Abstract
Regenerative electroless etching (ReEtching), described herein for the first time, is a method of producing nanostructured semiconductors in which an oxidant (Ox(1)) is used as a catalytic agent to facilitate the reaction between a semiconductor and a second oxidant (Ox(2)) that would be unreactive in the primary reaction. Ox(2) is used to regenerate Ox(1), which is capable of initiating etching by injecting holes into the semiconductor valence band. Therefore, the extent of reaction is controlled by the amount of Ox(2) added, and the rate of reaction is controlled by the injection rate of Ox(2). This general strategy is demonstrated specifically for the production of highly luminescent, nanocrystalline porous Si from the reaction of V2O5 in HF(aq) as Ox(1) and H2O2(aq) as Ox(2) with Si powder and wafers.



Last updated on 2024-26-11 at 18:53