A1 Refereed original research article in a scientific journal

Surface Passivation of Germanium with ALD Al2O3: Impact of Composition and Crystallinity of GeOx Interlayer




AuthorsIsometsä Joonas, Jahanshah Rad Zahra, Fung Tsun H., Liu Hanchen, Lehtiö Juha-Pekka, Pasanen Toni P., Leiviskä Oskari, Miettinen Mikko, Laukkanen Pekka, Kokko Kalevi, Savin Hele, Vähänissi Ville

PublisherMDPI

Publication year2023

JournalCrystals

Journal name in sourceCRYSTALS

Journal acronymCRYSTALS

Article number 667

Volume13

Issue4

Number of pages10

eISSN2073-4352

DOIhttps://doi.org/10.3390/cryst13040667

Web address https://doi.org/10.3390/cryst13040667

Self-archived copy’s web addresshttps://research.utu.fi/converis/portal/detail/Publication/179815269


Abstract
Germanium is an excellent material candidate for various applications, such as field effect transistors and radiation detectors/multijunction solar cells, due to its high carrier mobilities and narrow bandgap, respectively. However, the efficient passivation of germanium surfaces remains challenging. Recently, the most promising results have been achieved with atomic-layer-deposited (ALD) Al2O3, but the obtainable surface recombination velocity (SRV) has been very sensitive to the surface state prior to deposition. Based on X-ray photoelectron spectroscopy (XPS) and low-energy electron diffraction (LEED), we show here that the poor SRV obtained with the combination of HF and DIW surface cleaning and ALD Al2O3 results from a Ge suboxide interlayer (GeOx, x < 2) with compromised quality. Nevertheless, our results also demonstrate that both the composition and crystallinity of this oxide layer can be improved with a combination of low-temperature heating and a 300-Langmuir controlled oxidation in an ultrahigh vacuum (LT-UHV treatment). This results in a reduction in the interface defect density (D-it), allowing us to reach SRV values as low as 10 cm/s. Being compatible with most device processes due to the low thermal budget, the LT-UHV treatment could be easily integrated into many future devices and applications.

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Last updated on 2024-26-11 at 10:33