A1 Vertaisarvioitu alkuperäisartikkeli tieteellisessä lehdessä
First-Last: A Cost-Effective Adaptive Routing Solution for TSV-Based Three-Dimensional Networks-on-Chip
Tekijät: Amir Charif, Alexandre Coelho, Masoumeh Ebrahimi, Nader Bagherzadeh, Nacer-Eddine Zergainoh
Kustantaja: IEEE COMPUTER SOC
Julkaisuvuosi: 2018
Journal: IEEE Transactions on Computers
Tietokannassa oleva lehden nimi: IEEE TRANSACTIONS ON COMPUTERS
Lehden akronyymi: IEEE T COMPUT
Vuosikerta: 67
Numero: 10
Aloitussivu: 1430
Lopetussivu: 1444
Sivujen määrä: 15
ISSN: 0018-9340
DOI: https://doi.org/10.1109/TC.2018.2822269
Tiivistelmä
3D integration opens up new opportunities for future multiprocessor chips by enabling fast and highly scalable 3D Network-on-Chip (NoC) topologies. However, in an aim to reduce the cost of Through-silicon via (TSV), partially vertically connected NoCs, in which only a few vertical TSV links are available, have been gaining relevance. To reliably route packets under such conditions, we introduce a lightweight, efficient and highly resilient adaptive routing algorithm targeting partially vertically connected 3D-NoCs named First-Last. It requires a very low number of virtual channels (VCs) to achieve deadlock-freedom (2 VCs in the East and North directions and 1 VC in all other directions), and guarantees packet delivery as long as one healthy TSV connecting all layers is available anywhere in the network. An improved version of our algorithm, named Enhanced-First-Last is also introduced and shown to dramatically improve performance under low TSV availability while still using less virtual channels than state-of-the-art algorithms. A comprehensive evaluation of the cost and performance of our algorithms is performed to demonstrate their merits with respects to existing solutions.
3D integration opens up new opportunities for future multiprocessor chips by enabling fast and highly scalable 3D Network-on-Chip (NoC) topologies. However, in an aim to reduce the cost of Through-silicon via (TSV), partially vertically connected NoCs, in which only a few vertical TSV links are available, have been gaining relevance. To reliably route packets under such conditions, we introduce a lightweight, efficient and highly resilient adaptive routing algorithm targeting partially vertically connected 3D-NoCs named First-Last. It requires a very low number of virtual channels (VCs) to achieve deadlock-freedom (2 VCs in the East and North directions and 1 VC in all other directions), and guarantees packet delivery as long as one healthy TSV connecting all layers is available anywhere in the network. An improved version of our algorithm, named Enhanced-First-Last is also introduced and shown to dramatically improve performance under low TSV availability while still using less virtual channels than state-of-the-art algorithms. A comprehensive evaluation of the cost and performance of our algorithms is performed to demonstrate their merits with respects to existing solutions.
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