A1 Vertaisarvioitu alkuperäisartikkeli tieteellisessä lehdessä

Implementation of a Fast and Low-Power Thermopile Readout Circuit Arrangement for Array Processors




TekijätGrönroos Mika, Nevalainen Tapani, Paasio Ari

KustantajaIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

Julkaisuvuosi2018

JournalIEEE Transactions on Circuits and Systems II: Express Briefs

Vuosikerta65

Numero5

Aloitussivu537

Lopetussivu541

Sivujen määrä5

ISSN1549-7747

eISSN1558-3791

DOIhttps://doi.org/10.1109/TCSII.2018.2821898


Tiivistelmä

High-speed thermal imaging is necessary in many applications. However,
the traditional column-wise readout implementations reduce the
achievable frame rate. Also, analog integration for each individual
pixel is not possible without sacrificing pixel area. In this brief, we
present an implementation of a fast and low-power pixel-wise readout
circuit scheme with a digital integration method using 65-nm standard
CMOS technology. The power consumption of the readout circuit is up to
15 μW and the layout area is 100 μm × 100 μm. Furthermore, we analyze
our design for non-idealities, such as noise and process mismatches
using a circuit simulator.



Last updated on 2024-26-11 at 11:06