A1 Refereed original research article in a scientific journal

Fatigue resistance of dentin bonds prepared with two- vs. three-step adhesives: Effect of carbodiimide




AuthorsZhang Zihou, Beitzel Dylan, Majd Hessam, Mutluay Mustafa, Tezvergil-Mutluay Arzu, Tay Franklin R, Pashley David H, Arola Dwayne

PublisherElsevier Inc.

Publication year2017

JournalDental Materials

Journal name in sourceDental Materials

Volume33

Issue12

First page 1340

Last page1350

Number of pages11

ISSN0109-5641

eISSN1879-0097

DOIhttps://doi.org/10.1016/j.dental.2017.08.192


Abstract

The application of a cross-linker to demineralized dentin is reportedly effective at extending the durability of dentin bonds.

Objective: To compare the effect of a cross-linker pretreatment on the fatigue crack growth resistance of resin–dentin bonds prepared with a two- vs. three-step adhesive system.

Methods: Bonded interface Compact Tension (CT) specimens were prepared using commercial two- and three-step etch-and-rinse adhesives and compatible hybrid resin-composite. For the treated groups, adhesive bonding was preceded by a 1 min application of an experimental carbodiimide (EDC) conditioner to the acid-etched dentin. The control groups received no such treatment. The fatigue crack growth resistance was examined after storage in artificial saliva at 37 °C for 0, 3 and 6 months.

Results: There was no significant difference in the immediate fatigue crack growth resistance the control and EDC-treated groups at 0 months for either adhesive system. After 3 and 6 months of storage, the EDC-treated groups exhibited significantly greater (p ≤ 0.05) fatigue crack growth resistance than the controls. Although the EDC treatment was equally effective in deterring degradation for both adhesives, bonds prepared with the three-step system exhibited the lowest resistance to fatigue crack growth overall.

Significance: An EDC treatment applied during dentin bonding could help maintain the durability of bonds prepared with two or three-step adhesive bonding systems.



Last updated on 2024-26-11 at 17:59