Design and Management of High-Performance, Reliable and Thermal-Aware 3D Networks-on-Chip

: Rahmani Amir-Mohammad, Vaddina Kameswar Rao, Latif Khalid, Liljeberg Pasi, Plosila Juha, Tenhunen Hannu

Publisher: The Institution of Engineering and Technology - The IET

: 2012

IET Circuits, Devices and Systems

: 5

: 6

: 5

: 308

: 321

: 14

: 1751-858X