Thermal Analysis of Advanced 3D Stacked Systems




Kameswar Rao Vaddina, Rahmani Amir-Mohammad, Latif Khalid, Liljeberg Pasi, Plosila Juha

Susmita Sur-Kolay, Sri Parameswaran

PublisherIEEE

2011

IEEE Computer Society Annual Symposium on VLSI

IEEE

371

372

2159-3469




Last updated on 2024-26-11 at 12:08