Thermal Analysis of Advanced 3D Stacked Systems




Kameswar Rao Vaddina, Rahmani Amir-Mohammad, Latif Khalid, Liljeberg Pasi, Plosila Juha

Susmita Sur-Kolay, Sri Parameswaran

PublisherIEEE

2011

 IEEE Computer Society Annual Symposium on VLSI

IEEE

371

372

2159-3469




Last updated on 26/11/2024 12:08:36 PM