Power-Efficient Inter-Layer Communication Architectures for 3D NoC




Rahmani Amir-Mohammad, Latif Khalid, Vaddina Kameswar Rao, Liljeberg Pasi, Plosila Juha, Tenhunen Hannu

Susmita Sur-Kolay, Sri Parameswaran

PublisherIEEE

2011

IEEE Computer Society Annual Symposium on VLSI

IEEE

355

356

2159-3469




Last updated on 2024-26-11 at 12:49