Thermal Modelling of 3D Multicore Systems in a Flip-Chip Package

: Vaddina K R, Mitra T, Liljeberg P, Plosila J

Publisher: IEEE

: 2010

: IEEE International SoC Conference (SoCC 2010)

: 379

: 383

: 5

: 978-1-4244-6682-5

: 2164-1676

DOI: https://doi.org/10.1109/SOCC.2010.5784700(external)