High-Performance TSV Architecture for 3-D ICs




Daneshtalab M, Ebrahimi M, Liljeberg P, Plosila J, Tenhunen H

PublisherIEEE

2010

IEEE Computer Society Annual Symposium on VLSI

The 9th IEEE International Symposium on VLSI (ISVLSI)

978-1-4244-7321-2

2159-3469




Last updated on 2024-26-11 at 14:38